(footprint "PPAK5*6-8L" (version 20221018) (generator pcbnew)
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  (descr "Universal Footprint for Thermally-enhanced SO-8 packages; compatible with Vishay PowerPAK SO−8, International Rectifier PQFN, Texas Instrument SON 5 × 6 mm (Q5A), Alpha and Omega DFN 5 × 6, ST Microelectronics PowerFLAT™ 5 × 6, Toshiba SOP Advance, Infineon Super SO8, NXP LFPAK (SOT669), Renesas WPAK(3F) / LFPAK, Fairchild Power 56, APEC PMPAK 5 × 6, MagnaChip PowerDFN56, ROHM HSOP8, UBIQ PRPAK56, NIKO−SEM PDFN 5 × 6, NEC 8-pin HVSON. Datasheets: https://www.onsemi.com/pub/Collateral/AND9137-D.PDF, https://assets.nexperia.com/documents/leaflet/75016838.pdf")
  (tags "Thermally-enhanced SO-8 PowerPAK PQFN Q5A PowerFLAT LFPAK SOT669 WPAK(3F) LFPAK Power56 PMPAK PowerDFN56 HSOP8 PRPAK56 PDFN HVSON")
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    (options (clearance outline) (anchor rect))
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  (model "${KICAD6_3DMODEL_DIR}/Package_DFN_QFN.3dshapes/PQFN-8-EP_6x5mm_P1.27mm_Generic.wrl"
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    (scale (xyz 1 1 1))
    (rotate (xyz 0 0 0))
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)
